Mechanical and Hardware Systems Architect

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Mechanical and Hardware Systems Architect

Description -

We are seeking a highly experienced and innovative Mechanical and Hardware Systems Architect to lead the design and development of advanced mechanical and thermal solutions for cutting-edge products and platforms. This role involves overseeing multiple project teams, collaborating with internal and external partners, and driving strategic initiatives in component design and integration.

Key Responsibilities

• Lead cross-functional teams through all phases of mechanical and thermal development, including concept design, validation, tooling, and testing.
• Foster and manage strategic relationships with internal stakeholders and outsourced development partners to ensure high-quality mechanical design execution.
• Review and assess design outputs and project deliverables for compliance with engineering standards and best practices, providing actionable feedback to enhance product quality.
• Drive technical decision-making and serve as a subject matter expert in material, manufacturing mothods, DFM/DFA, thermal/mechanical analysis and system integration
• Champion the adoption of emerging technologies and innovative design methodologies within the mechanical and thermal engineering domain.
• Define and drive the strategy for key mechanical components such as touch interfaces, keyboards, and connectors.
• Evaluate vendors and manufacturing processes; participate in supplier development.
• Contribute to long-term product strategy and R&D efforts
• Mentor and guide junior engineers, fostering a culture of technical excellence and continuous improvement.
  
  

Qualifications

• Bachelor's or master's degree in mechanical engineering.
• 8-12 years of experience in mechanical design, preferably in notebook, Tablet, mobility, or AR/VR product, or other consumer electronics development.
• Proficiency in 3D CAD tools such as Creo or equivalent.
• Experience with FEA and thermal/structural simulations
• Experience with mechanical architecture and structural design, including material science, thermal design management, hardware integration, and their associated design constraints in electronic system structures.
• Strong analytical and problem-solving skills with a deep understanding of mechanical and thermal architecture in electronic systems.
• Familiarity with design for manufacturability and a range of manufacturing processes (machining, injection molding, die casting, sheet metal)
• Exceptional communication skills with the ability to articulate complex design concepts and influence senior leadership.
  
  

The pay range for this role is $104,800 to $158,250 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)
  
  

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

25%

Relocation -

Yes

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you'd like more information about HP's EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law - Supplement