Hybrid Wire Bonder Micro Assembler - 1st

The ideal candidate will work in a cleanroom environment wearing required cleanroom attire.Responisble for running automatic and/or manual bonding machines that bonds gold and /or aluminum wires to microelectronic integrated circuits; connecting IC’s to circuitry then to package leads. RequirementsFamiliar with operation of all the wire bonding equipment in the Wire bond / Assembly area, as well as understanding the manufacturing processes.Maintain proper documentation on job travelers, logs, and bills of materials.Able to understand job travelers and drawings to ensure that all requirements are met.Able to assemble, rework and/or test electronic components following prescribed processes and assembly procedures.Able to use hand tools and equipmentSet up work as required, as well as movement of materialWork from drawings, schematics, and written instructions to affect mechanical assemblyPerform quality inspections and confirm the line up with quality specifications, quality and safety guidelines.Minimum 2 years of manual wire bonding experience -Aluminum experience preferredAble to read complex assembly drawings to determine sequence of operationAble to use computersGood communication skillsStrong attention to detailAbility to work well in a fast-paced environmentGood manual dexterity for handling precise small fragile components under a microscope using tweezers and probes.Working knowledge and the use of low- and high-powered microscopes for wire bonding.Ability to assemble integrated microcircuits to the following standards:*MIL-PRF-38535*MIL-PRF-19500*MIL-STD-750*MIL-STD-883Experience in the proper setup and operations of the following machines without assistance is a plus:F&K, K&S, Orthodyne, or similar small-diameter wire bonding equipment.Company DescriptionOur client is a reputable manufacturing company offering a permanent opportunity, competitive salary and great benefits.

Salary : $24 - $34