Principal Layout Designer

Seeking a Layout Designer responsible for the layout of RF and mixed signal MCM's from schematics, diagrams or netlists utilizing leading laminate technologies in accordance with DFM/DFA rules. Responsible for taking the design from schematic through layout, design verification, DRC’s and tape-out in a timely manner with minimal assistance. Exposure to RF circuit and transmission line layouts is a plus.

As a skilled specialist in MCM layout, candidate demonstrate the ability to complete tasks in creative and effective ways, and work on assignments requiring considerable judgement and initiative. The candidate shall understand implications of the work and be able to make recommendations for solutions, methodologies, and procedures.

This position can be based out of one of the following locations: Woburn or Andover, MA; Irvine, CA; or Ottawa, Canada

• Layout of RF and mixed-signal multi chip modules (MCM's) components from schematics, diagrams or netlists utilizing laminate technologies in accordance with design rules.
• Directly interfacing with the MCM design engineers to produce and optimize layouts for size and performance.
• Establish and meet project objectives and milestones.

• An AS in electronics,
  • OR, a 2-year technical certificate with in-depth knowledge of analog and digital circuit theory,
  • OR, 5 years of equivalent industry experience.
  • A BSEE or BSEET is preferred.
• Demonstrated ability to be detail oriented with strong customer service skills.
• Ability to work within schedule constraints and maintain high quality standards.
• Proficiency in written and verbal communication skills and the ability to work with multiple groups.
• 5 years of experience with PCB layout and design of RF, analog, and mixed signal PCBs using Cadence Allegro versions 16-23.
• Proficiency with all aspects of Cadence Allegro tool, including use of constraint manager and manufacturing functions, as well as pad stack and library symbol creation
• 5 years of experience using a schematic/netlist driven CAD layout process. Knowledge of Agilent ADS is highly desirable.
• Solid design experience with HDI stackups, including use of blind/buried micro vias and specialty RF dielectric materials, and trace width/spacing down to 2/2 or below.
• In-depth knowledge of RF PCB layout techniques, including impedance control and EMI design considerations.
• 5 years of experience using a CAM package for manufacturing data validation. Knowledge CAM350 is preferred.
• Working knowledge of JEDEC /IPC design, fabrication, and assembly specifications.
• Experience creating assembly documentation and fabrication deliverables per detailed company and industry standards.
• Experience with SAP or Agile document control systems.
• Demonstrated ability to import, modify and export DXF PCB outline data.
• Knowledge of Cadence APD, wireless semiconductor industry, semiconductor packaging, and microelectronic assembly processes is highly desirable