What are the responsibilities and job description for the Senior Assembler position at Teledyne Technologies Incorporated?
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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Teledyne HiRel e2v is a global leader in high-reliability semiconductor and microelectronics solutions for aerospace, defense, and industrial markets. Our Milpitas facility is a center of excellence for advanced microelectronics assembly, supporting mission-critical applications with precision and quality.
Position Summary
We are seeking a highly skilled and detail-oriented Senior Assembler to perform complex microelectronics assembly tasks in a cleanroom environment. This role requires expertise in die attach, wire bonding, sealing, and inspection processes, with a strong focus on quality and reliability.
Key Responsibilities
$61,600.00-$82,100.000
Pay Transparency
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Teledyne HiRel e2v is a global leader in high-reliability semiconductor and microelectronics solutions for aerospace, defense, and industrial markets. Our Milpitas facility is a center of excellence for advanced microelectronics assembly, supporting mission-critical applications with precision and quality.
Position Summary
We are seeking a highly skilled and detail-oriented Senior Assembler to perform complex microelectronics assembly tasks in a cleanroom environment. This role requires expertise in die attach, wire bonding, sealing, and inspection processes, with a strong focus on quality and reliability.
Key Responsibilities
- Perform precision assembly of microelectronic components using manual and automated tools.
- Operate equipment for die attach, wire bonding, epoxy dispense, lid sealing, and related processes.
- Interpret and follow detailed work instructions, assembly drawings, and process travelers.
- Conduct in-process inspections using microscopes and measurement tools to ensure compliance with specifications.
- Collaborate with engineering and quality teams to resolve technical issues and support process improvements.
- Maintain accurate production records and documentation.
- Adhere to cleanroom protocols, ESD procedures, and safety standards.
- Minimum 5 years of hands-on experience in microelectronics or semiconductor assembly.
- Proficiency in fine-pitch wire bonding, die attach, and epoxy processes.
- Strong understanding of MIL-STD -883; MIL-PRF-38535; MIL-PRF-38534 , J-STD-001, or similar quality standards.
- Ability to work under a microscope for extended periods with high attention to detail.
- Familiarity with cleanroom practices and ESD handling.
- U.S. citizenship or permanent residency required due to ITAR regulations.
- Experience in a high-reliability or aerospace/defense manufacturing environment.
- Certification in J-STD-001 or IPC-A-610.
- Associate degree or technical training in electronics or manufacturing.
- Proficient in Microsoft product suite
- Familiarize with manufacturing terminologies
- A team player is preferred
$61,600.00-$82,100.000
Pay Transparency
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.
Salary : $61,600 - $82,100
